![]() ![]() It can also do many other tuber floating type of snacks with high moisture in raw product. Suitable for cost effective and continuous production of banana, sweet potato, cassava, tapioca, yuca, yams, taro chips, crisp, stick or wafer. Uses of semi automatic cassava, plantain and banana slicing machines The thickness of the slices is predetermined by adjusting the gap of knife. The whole tuber falls vertically as it is manually fed by the operator against the fixed tuber slicing die and become sliced. It is manually fed with one tuber at a time through the rotating feeding head. The slicer is operated by an electric motor and power transmitted to the directly coupled with aluminium manual tuber feeder head. "Jas" Banana wafer machine is fabricated from non corrosive materials. Construction of cassava, plantain and banana slicing machines These wafers are then packed in polyethylene bags of suitable gauge and size to prevent spoilage. The cassava, plantain and banana chips are fried in vegetable oil by Jas batch type fryer and cooled down to the room temperature. Sometimes turmeric powder is also used for coloring the banana chips or to improve color. The bananas thus prepared are then dipped in brine water to avoid oxidation. Just one unskilled labor has to keep feeding peeled banana by using both hands one after another end chips falls directly into frying vessel or brine water. Due to auto pressure system very easy to use, without pulley belts and no fear for heat while frying, you can set thickness of wafer, chips, crisp as you need thick or thin. The blade is set to cut at predetermined thickness usually from 1 mm-6 mm. The peeled cassava, plantain and banana is move back and forth on the blade with relative force. It has a stationary blade on a solid platform with little opening just under the tip of the cutting edge through which sliced cassava, plantain and banana are collected. There is a mini machine that does this manually. cassava, plantain and banana slicing is done by Jas cassava, plantain and banana wafer (chips) machines have been manufactured with the latest technology. The manufacturing process of batch type cassava, plantain and banana chips, crisp or wafer making machinesįirm plantain and banana are washed, peeled manually and sliced. Packing Benefits of cassava, plantain and banana slicing machine The production process mainly comprises of the following steps:. plantain and banana wafers must be manufactured in a scientific manner and under hygienic conditions. The simplest chips of the kind that are just cooked and salted, but manufacturers can add a wide variety of seasonings of herbs, spices, cheese or artificial additives. Flow diagram of commercial batch type plantain and banana chips making machine Feeding is done manual in our banana wafer machines. The machine with rotated head and base foundation, in this machine plain wafer like a longitudinal or round can be cutting on this machine. ![]() This professional banana / plantain wafer machines are fabricated from non corrosive materials. Excess oil is extracted and fried banana wafers are seasoned with salt and other spices as per the requirement and then packed in pouches using suitable packing machine. The slices are then fried in cooking oil. Banana / plantain wafers are made by cutting plantain / bananas into thin slices. Description of Cassava, plantain and banana slicing machineĬassava, plantain and banana wafers are a popular snack eaten world over. ![]()
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